Creep behavior of cold-rolled nanocrystalline pure copper

被引：36

作者：

Cai, B

Kong, QP ^{[1
]}

Cui, P

Lu, L

Lu, K

机构：

[1] Acad Sinica, Inst Solid State Phys, Internal Frict & Defects Solids Lab, Hefei 230031, Peoples R China

[2] Chinese Acad Sci, Met Res Inst, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China

来源：

SCRIPTA MATERIALIA | 2001年 / 45卷 / 12期

基金：

中国国家自然科学基金;

关键词：

creep; nanocrystalline copper; cold rolling; grain boundary;

D O I：

10.1016/S1359-6462(01)01177-0

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The creep of cold rolled nanocrystalline Cu has been investigated at 20-50 degreesC. The most reasonable stress exponent is found to be 2, the corresponding activation energy is 0.82 eV. The results imply that the creep is possibly associated with grain boundary sliding. The increase of threshold stress after rolling is associated with the increase of microstrain. (C) 2001 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.

引用

页码：1407 / 1413

页数：7

共 20 条

[1]

ARTZ E, 1983, ACTA METALL, V31, P1977

[2] Low temperature creep of nanocrystalline pure copper [J].