Microstructure Evolution of Sn-3.5Ag-1.0Cu-0.5Ni/Cu System Lead Free Solder Under Long Term Thermal Aging

被引：1

作者：

Ab Ghani, Noor Asikin ^{[1
]}

Yahya, Iziana ^{[1
]}

Salleh, Mohd Arif Anuar Mohd ^{[2
]}

Shamsuddin, Saidatulakmar ^{[1
]}

Ahmad, Zainal Arifin ^{[3
]}

Mayappan, Ramani ^{[1
]}

机构：

[1] Univ Teknol MARA Perlis, Fac Sci Appl, Perlis 02600, Malaysia

[2] Univ Malayasia Perlis, Sch Mat Engn, Arau, Perlis, Malaysia

[3] Univ Sains Malaysia, Sch Mat & Mineral Resources Engn, George Town, Malaysia

来源：

ADVANCED X-RAY CHARACTERIZATION TECHNIQUES | 2013年 / 620卷

关键词：

Sn-Ag-Cu-Ni; intermetallic; scanning electron microscope; powder metallurgy; thermal aging; JOINTS; NI;

D O I：

10.4028/www.scientific.net/AMR.620.263

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Due to environmental concerns, lead-free solders were introduced in replacing the lead-based solders in microelectronics devices technology. Although there are many lead-free solder available, the Sn-Ag-Cu solder was considered the best choice. But the solder has its draw backs in terms of melting temperature and intermetallic formations. In this study, the effect of 0.5wt% Ni addition on the microstructure of the Sn-3.5Ag-1.0Cu solder was investigated. The solder was synthesized via powder metallurgy route which includes blending, compacting and sintering. The solders were characterized for its densities and melting temperatures. SEM was used to observe the microstructure of intermetallic phases. The solders were melted on copper substrate at 250 degrees C for one minute and aged at 150 degrees C from 0 to 400 hours. The phases formed were studied under SEM. The SEM results showed the presence of Cu6Sn5, Cu3Sn, Ag3Sn and (Cu,Ni)(6)Sn-5 intermetallics.

引用

页码：263 / +

页数：2

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