Delay analysis of buffer inserted sub-threshold interconnects

被引:7
|
作者
Dhiman, Rohit [1 ]
Chandel, Rajeevan [1 ]
机构
[1] Natl Inst Technol Hamirpur, Elect & Commun Engn Dept, Hamirpur 177005, HP, India
关键词
Buffer; Delay; Interconnects; Metal-oxide semiconductor field-effect transistor (MOSFET); Very large scale integration (VLSI); Variability; Ultra-low power; REPEATER INSERTION; GLOBAL INTERCONNECTS; CIRCUITS; POWER; CROSSTALK; OPERATION; DESIGN; MODELS; LOGIC; VLSI;
D O I
10.1007/s10470-016-0860-8
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
In this paper, an analysis of interconnect delay minimization by CMOS buffer insertion in sub-threshold regime is presented. Analytical expressions are developed to calculate the total delay and optimum number of buffers required for delay minimization in sub-threshold interconnects. Considering delay minimization by buffer insertion, the effects of voltage-scaling on the delay and optimum number of buffers have been analyzed. It is demonstrated that voltage scaling in sub-threshold regime reduces the number of buffers required to attain the minimum delay. This is one more advantage of voltage-scaling in addition to the usual reduction in power dissipation, in the sense that lesser silicon area is consumed. For a wide variety of typical interconnect loads, analytically obtained results are in good agreement with SPICE extracted results for most of the cases more than 90 %. Finally, the variability analysis of sub-threshold interconnects is investigated using Monte Carlo analysis.
引用
收藏
页码:435 / 445
页数:11
相关论文
共 50 条
  • [1] Delay analysis of buffer inserted sub-threshold interconnects
    Rohit Dhiman
    Rajeevan Chandel
    Analog Integrated Circuits and Signal Processing, 2017, 90 : 435 - 445
  • [2] Electronic transport in doped and dielectric inserted MLGNR interconnects: Crosstalk induced delay and stability analyses at sub-threshold regime
    Sidhu, Ramneek
    Rai, Mayank Kumar
    MICROELECTRONICS JOURNAL, 2022, 128
  • [3] Proposal and Analysis of Mixed CNT Bundle for Sub-Threshold Interconnects
    Singh, Ashish
    Dhiman, Rohit
    IEEE TRANSACTIONS ON NANOTECHNOLOGY, 2019, 18 : 584 - 588
  • [4] Comparative Analysis of Delay for Sub-threshold CMOS Logics
    Jain, Sankalp
    Chanda, Manash
    Sarkar, Chandan Kumar
    2013 STUDENTS CONFERENCE ON ENGINEERING AND SYSTEMS (SCES): INSPIRING ENGINEERING AND SYSTEMS FOR SUSTAINABLE DEVELOPMENT, 2013,
  • [5] Over/Undershooting Effects in Accurate Buffer Delay Model for Sub-Threshold Domain
    Corsonello, Pasquale
    Frustaci, Fabio
    Lanuzza, Marco
    Perri, Stefania
    IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 2014, 61 (05) : 1456 - 1464
  • [6] Modeling of Mixed CNT Bundle for Sub-threshold Interconnects
    Singh, Ashish
    Dhiman, Rohit
    Chandel, Rajeevan
    2018 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS 2018), 2018,
  • [7] Proposal and analysis of relative stability in mixed CNT bundle for sub-threshold interconnects
    Singh, Ashish
    Chandel, Rajeevan
    Dhiman, Rohit
    INTEGRATION-THE VLSI JOURNAL, 2021, 80 : 29 - 40
  • [8] Modeling and Analysis of Cu-Carbon Nanotube Composites for Sub-Threshold Interconnects
    Singh, Ashish
    Kaushik, Brajesh Kumar
    Dhiman, Rohit
    IEEE OPEN JOURNAL OF NANOTECHNOLOGY, 2022, 3 : 236 - 243
  • [9] High-speed sub-threshold operation of carbon nanotube interconnects
    Sathyakam, Piratla Uma
    Mallick, Partha S.
    Saxena, Anmol Ajay
    IET CIRCUITS DEVICES & SYSTEMS, 2019, 13 (04) : 526 - 533
  • [10] Compact models and delay computation of sub-threshold interconnect circuits
    Rohit Dhiman
    Rohit Sharma
    Rajeevan Chandel
    Analog Integrated Circuits and Signal Processing, 2015, 84 : 53 - 65