Statistical optimisation of thermoplastic injection moulding process for the encapsulation of electronic subassembly

This paper reports work from a major UK research project which seeks to develop a cost effective integrated production technology for the manufacture of plastic automotive components with embedded electronics and power distribution. The said electronics sub-systems are simultaneously packaged within the automotive structural thermoplastic (TP) component during the injection moulding process. Such innovative process and product integration represents an opportunity to significantly reduce component counts and wiring loom overhead for the vehicle. The assembly, weight and cost advantages envisaged from the proposed technology will satisfy the ever-increasing demand for automotive suppliers to manufacture complete, ready-to-assemble, reconfigurable component modules with superior reliability and as such may contribute to the increased incorporation of vehicle telematics. The paper addresses the technological and economic implications of the proposed overmoulding technology, presenting particular aspects of technological hurdles such as thermal, electrical and process requirements in the production of highly integrated polymer encapsulated electronics products. This paper highlights the findings derived from experiments undertaken to explore critical factors in the manufacture of such encapsulated electronics sub-systems, including such variables as electronics interconnection, materials selection and interactions and moulding process parameters.