The development of an atom chip with through silicon vias for an ultra-high-vacuum cell

This paper describes the development, fabrication and examination of an atom chip through silicon vias (TSV), which is anodically bonded with a Pyrex glass cell to form an ultra-high-vacuum system for the application of Bose-Einstein condensation (BEC) experiments. The silicon via is etched by the inductively coupled plasma reactive ion etch and filled by copper plating technology. The metal wires on both sides of the atom chips are patterned by the lithography process. Three different sizes of TSV are made and tested by continuously applying a maximum current of 17 A under the vacuum (70 Torr) and in air. In addition, after the thermal cycling of an anodic bonding process (requested at 350 degrees C) and a high electric field of 1000 V m(-1), the TSV on atom chips can still hold the ultra-high vacuum (UHV). The conductive and vacuum yields of the TSV improved from 50% to 100% and from 75% to 81.25%, respectively after the modification of the fabrication process. Finally, the UHV test of TSV on atom chips at room temperature can be reached at 8 x 10(-10) Torr, thus satisfying the requirements of atomic physics experiments under the UHV environment.