Preparation and thermal properties of resole-type phenol resin-clay nanocomposites

被引:14
作者
Kato, M [1 ]
Tsukigase, A
Usuki, A
Shimo, T
Yazawa, H
机构
[1] Toyota Cent Res & Dev Labs Inc, Organ Mat Lab, Nagakute, Aichi 4801192, Japan
[2] Toyota Ind Corp, Aichi 4748601, Japan
[3] Sumitomo Bakelite Co Ltd, Fujieda, Shizuoka 4260041, Japan
关键词
thermosets; plastics; organoclay; nanocomposites; TEM;
D O I
10.1002/app.22850
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
Resole-type phenol resin-clay nanocomposites have been prepared successfully by melt compounding phenol resin with organophilic clay. In the resulting phenol resin- clay nanocomposite, the silicate layers of the clay were exfoliated and dispersed as monolayers. The nanocomposite exhibited higher long-term heat resistance when compared with unmodified phenol resin. It was surmised that the silicate layers of the clay acted as barriers to oxygen penetration into the resin, as the degree of heat degradation of the nanocomposite was much lower than that of the straight phenol resin. (c) 2006 Wiley Periodicals, Inc.
引用
收藏
页码:3236 / 3240
页数:5
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