Non-destructive evaluation of the hidden voids in integrated circuit packages using terahertz time-domain spectroscopy

被引：40

作者：

Park, Sung-Hyeon ^{[1
]}

Jang, Jin-Wook ^{[2
]}

Kim, Hak-Sung ^{[1
,3
]}

机构：

[1] Hanyang Univ, Sch Mech Engn, Seoul 133791, South Korea

[2] Samsung Elect, Package Engn Team, Asan 336711, Chungcheong Nam, South Korea

[3] Hanyang Univ, Inst Nano Sci & Technol, Seoul 133791, South Korea

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2015年 / 25卷 / 09期

基金：

新加坡国家研究基金会;

关键词：

non-destructive; terahertz; void; IC package; detection; DEFECTS; INSPECTION;

D O I：

10.1088/0960-1317/25/9/095007

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this work, a terahertz time-domain spectroscopy (THz-TDS) imaging technique was used as a non-destructive inspection method for detecting voids in integrated circuit (IC) packages. Transmission and reflection modes, with an angle of incidence of 30 degrees, were used to detect voids in IC packages. The locations of the detected voids in the IC packages could be calculated by analyzing THz waveforms. Finally, voids that are positioned at the different interfaces in the IC package samples could be successfully detected and imaged. Therefore, this THz-TDS imaging technique is expected to be a promising technique for non-destructive evaluation of IC packages.

引用

页数：9

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