Immersion specific defect mechanisms: Findings and recommendations for their control

被引：13

作者：

Kocsis, Michael ^{[1
,2
]}

Van den Heuvel, Dieter ^{[1
]}

Gronheid, Roel ^{[1
]}

Maenhoudt, Mireille ^{[1
]}

Vangoidsenhoven, Dizana ^{[1
]}

Wells, Greg ^{[1
,3
]}

Stepanenko, Nickolay ^{[1
,4
]}

Benndorf, Michael ^{[5
]}

Kim, Hyun Woo ^{[1
,6
]}

Kishimura, Shinji ^{[1
,7
]}

Ercken, Monique ^{[1
]}

Van Roey, Frieda ^{[1
]}

O'Brien, S. ^{[1
,3
]}

Fyen, Wim ^{[1
]}

Foubert, Philippe ^{[1
]}

Moerman, Richard ^{[8
]}

Streefkerk, Bob ^{[8
]}

机构：

[1] IMEC, Kapeldreef 75, B-3001 Louvain, Belgium

[2] Intel Corp, Santa Clara, CA 95052 USA

[3] Texas Instruments Inc, Dallas, TX 75243 USA

[4] Infineon Technol SC300 GmbH & Co OHG, D-01099 Dresden, Germany

[5] Philips Res Europe, B-3001 Leuven, Belgium

[6] Samsung Elect Co Ltd, Yongin 449771, South Korea

[7] Matsushita Elect Ind Co Ltd, Kyoto 6018413, Japan

[8] ASML, NL-5504 DR Veldhoven, Netherlands

来源：

OPTICAL MICROLITHOGRAPHY XIX, PTS 1-3 | 2006年 / 6154卷

关键词：

immersion; defects; bubbles; water marks; wafer edge film peeling; particle transport;

D O I：

10.1117/12.660432

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

Defectivity has been one of the largest unknowns in immersion lithography. It is critical to understand if there are any immersion specific defect modes, and if so, what their underlying mechanisms are. Through this understanding, any identified defect modes can be reduced or eliminated to help advance immersion lithography to high yield manufacturing. Since February 2005, an ASML XT: 1250Di immersion scanner has been operational at IMEC. A joint program was established to understand immersion defectivity by bringing together expertise from IMEC, ASML, resist vendors, IC manufactures, TEL, and KLA-Tencor. This paper will cover the results from these efforts. The new immersion specific defect modes that will be discussed are air bubbles in the immersion fluid, water marks, wafer edge film peeling, and particle transport. As part of the effort to understand the parameters that drive these defects, IMEC has also developed novel techniques for characterizing resist leaching and water uptake. The findings of our investigations into each immersion specific defect mechanism and their influencing factors will be given in this paper, and an attempt will be made to provide recommendations for a process space to operate in to limit these defects.

引用

页码：U188 / U199

页数：12

共 11 条

[1]

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[2]

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[3]

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[4]

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[5]

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[6]

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[7]

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[8]

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[9]

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[10]

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