An E-Band Power Amplifier With 26.3% PAE and 24-GHz Bandwidth in 22-nm FinFET CMOS

被引:48
作者
Callender, Steven [1 ]
Pellerano, Stefano [2 ]
Hull, Christopher [2 ]
机构
[1] Intel Labs, Dev Next Generat Wireless Syst, Hillsboro, OR 97124 USA
[2] Intel Labs, Hillsboro, OR 97124 USA
关键词
FinFET; millimeter; wave (mmW) circuits; phased arrays; power amplifiers (PAs); wideband; TRANSFORMER;
D O I
10.1109/JSSC.2019.2899493
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents the design and optimization of an E-hand power amplifier (PA) implemented in Intel's 22FFL FinFET process. Layout optimization and characterization of the PA unit cell yielding optimal millimeter-wave (mmW) performance of the active device are described. A holistic optimization methodology is also presented which co-optimizes efficiency of the active devices and passive networks by incorporating passive losses earlier in the design process. The measured PA achieves a peak gain of 18.6 dB with a 3-dB bandwidth of 62-86 GHz (24 GHz). At 75 GHz, the measured P-sat, OP1dB, and peak power added efficiency (PAE) are +12.6 dBm, +5.7 dBm, and 26.3%, respectively. The PA can amplify a 6-Gb/s 16-QAM signal at an average P-out of +5 dBm with a PAE of 10% and -26-dB EVM(rms) and a 9-Gb/s 64-QAM signal at an average P-out of +1.3 dBm with a PAE of 5% and 28.3-dB EVM(rms). The compact layout of the PA yields a core area of 0.054 mm(2), enabling compact integration.
引用
收藏
页码:1266 / 1273
页数:8
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