Microstructure and interfacial characteristics of aluminium-diamond composite materials

被引：70

作者：

Khalid, FA

Beffort, O ^{[1
]}

Klotz, UE

Keller, BA

Gasser, P

机构：

[1] EMPA, Swiss Fed Inst Mat Testing & Res, CH-3602 Thun, Switzerland

[2] EMPA, Swiss Fed Inst Mat Testing & Res, CH-8600 Dubendorf, Switzerland

来源：

关键词：

aluminium-diamond composites; microstructure; interfacial structure and Al4C3;

D O I：

10.1016/j.diamond.2003.11.095

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This work reports about microstructure, morphology and interfacial characteristics of aluminium-based composites reinforced with micro- and nano-sized diamond particles. Composite samples were produced by pressurized liquid metal infiltration (squeeze casting) of tap-packed diamond powders, and studied by transmission electron microscopy (TEM) and Raman spectroscopy techniques. The micro-sized diamond particles were observed to be homogeneously dispersed and well bonded in the Al-matrix. However, the nano-sized diamond particles principally appear as large agglomerates in the Al-matrix, even though individual nano-sized diamonds are found to be finely dispersed in the Al-matrix too. The M-diamond interface is generally clean, i.e. devoid of reaction products. However, an interfacial amorphous disordered carbon layer is occasionally observed, and in the composite with the nano-sized diamonds aluminium carbide phases (A],C,) are randomly formed. (C) 2003 Elsevier B.V. All rights reserved.

引用

页码：393 / 400

页数：8

共 16 条

[1]

[Anonymous], JOM

[2]

[Anonymous], 1979, PROPERTIES DIAMOND

[3]

BARNIER V, 2002, 860099 EMPA

[4]

GASSER P, 2003, IN PRESS MICROS MICR

[5] STRUCTURAL STUDIES OF DIAMOND FILMS AND ULTRAHARD MATERIALS BY RAMAN AND MICRO-RAMAN SPECTROSCOPIES [J].

HUONG, PV .

[6]

Jacob P., 1999, Proceedings of the 1999 7th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.99TH8394), P69, DOI 10.1109/IPFA.1999.791307

[7] DIAMOND/AL METAL-MATRIX COMPOSITES FORMED BY THE PRESSURELESS METAL INFILTRATION PROCESS [J].