Kinetic aspects of the grain boundary segregation in Cu(Bi) alloys

被引：31
作者：
Chang, LS
Rabkin, E
Hofmann, S
Gust, W
机构：
[1] Max Planck Inst Met Forsch, D-70174 Stuttgart, Germany
[2] Inst Met Kunde, D-70174 Stuttgart, Germany
[3] Technion Israel Inst Technol, Dept Mat Engn, IL-32000 Haifa, Israel
来源：
ACTA MATERIALIA | 1999年 / 47卷 / 10期
基金：
以色列科学基金会;
关键词：
Auger electron microscopy; copper alloys; pipe diffusion; grain boundaries; segregation;
D O I：
10.1016/S1359-6454(99)00168-8
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The kinetics of grain boundary segregation in Cu(Bi) alloys has been studied at temperatures of 600 and 850 degrees C by Auger electron spectroscopy. A substantial acceleration of the grain boundary segregation kinetics in the two-phase area of the Cu-Bi phase diagram is observed. To explain this acceleration, a model of dislocation diffusion is proposed. In the framework of the model, the accelerated kinetics of grain boundary segregation in the two-phase area of the Cu-Bi phase diagram results from the microscopic pipe-like precipitation of a Bi-rich liquid phase along the dislocation cores. The dislocation diffusivities are estimated and two kinds of diagrams of the segregation kinetics are constructed. (C) 1999 Acta Metallurgica Inc. Published by Elsevier Science Ltd. All rights reserved.
引用
收藏
页码：2951 / 2959
页数：9
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