Microstructure and properties of a copper electrocontact material with a nanodispersed titanium dioxide additive

被引：5

作者：

Zeer, G. M. ^{[1
]}

Zelenkova, E. G. ^{[1
]}

Sidorak, A. V. ^{[1
]}

Ledyaeva, O. N. ^{[1
]}

Kuchinskii, M. Yu. ^{[1
]}

机构：

[1] Siberian Fed Univ, Krasnoyarsk 660041, Russia

来源：

TECHNICAL PHYSICS | 2013年 / 58卷 / 05期

关键词：

Molyb Denum Disulfide; Physicomechanical Property; Copper Powder; Oxide Inclusion; Dispersion Hardening;

D O I：

10.1134/S1063784213050253

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

The influence of TiO2 nanopowder additive on the microstructure, physicomechanical properties, and performance characteristics of a copper-based composite is studied. The properties of the composites are compared with those of pure copper compacts. The microstructure and state of the composite's working surface after performance tests are examined. It is shown that, when the amount of TiO2 grows, the hardness of the material rises and the arc quenching effect is enhanced.

引用

页码：710 / 714

页数：5