In situ study of the real-time growth behavior of Cu6Sn5 at the Sn/Cu interface during the soldering reaction

被引：85

作者：

Qu, L. ^{[1
]}

Zhao, N. ^{[1
]}

Zhao, H. J. ^{[1
]}

Huang, M. L. ^{[1
]}

Ma, H. T. ^{[1
]}

机构：

[1] Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China

来源：

SCRIPTA MATERIALIA | 2014年 / 72-73卷

基金：

中国国家自然科学基金;

关键词：

Soldering; Synchrotron radiation; Interfacial reaction; Intermetallic compounds; Kinetics; INTERMETALLIC COMPOUND; SN; CU; EVOLUTION; AG3SN;

D O I：

10.1016/j.scriptamat.2013.10.013

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The growth behavior of intermetallic compound (IMC) at the Sn/Cu interface during the soldering reaction was studied using synchrotron radiation real-time imaging technology. The annexation behavior of adjacent IMC grains, which slowed down with the soldering process, was directly observed for the first time. The IMC grains undergoing annexation tended to maintain a hemispherical morphology which was influenced by the radius of curvature of the nearest IMC grain. The annexation behavior was driven by the Gibbs Thomson effect. (C) 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：43 / 46

页数：4

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