Effects of pressure on electroplating of copper using supercritical carbon dioxide emulsified electrolyte

被引：33

作者：

Chang, Tso-Fu Mark ^{[1
]}

Shimizu, Tetsuya ^{[1
]}

Ishiyama, Chiemi ^{[1
]}

Sone, Masato ^{[1
]}

机构：

[1] Tokyo Inst Technol, Precis & Intelligence Lab, Midori Ku, Yokohama, Kanagawa 2268503, Japan

来源：

THIN SOLID FILMS | 2013年 / 529卷

关键词：

Copper electroplating; Supercritical carbon dioxide emulsion; Pressure; Copper-sulfate-based electrolyte; CO2; FLUID; ELECTRODEPOSITION;

D O I：

10.1016/j.tsf.2012.05.058

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Electroplating of Cu with supercritical CO2 emulsion (SCE) is studied to clarify the effects of SCE in the electroplating reaction. Properties of the SCE can be adjusted by pressure. Size and size distribution of the dispersed phase are reduced by increasing pressure, which is expected to promote the transfer efficiency of Cu2+ into the diffusion layer and causes a decrease in on-time of the periodic-plating-characteristic in the electroplating with SCE (ESCE). A minimum value for both surface roughness and grain size was observed for the Cu films electroplated at 15 MPa when pressure was increased from 9 to 21 MPa. The most positive potential response was observed for ESCE also at 15 MPa in chronopotentiometry. Therefore, we believed a critical size for the dispersed phase was reached at roughly 15 MPa to cause the phenomena observed. (C) 2012 Elsevier B.V. All rights reserved.

引用

页码：25 / 28

页数：4

共 12 条

[1] Function and mechanism of supercritical carbon dioxide emulsified electrolyte in nickel electroplating reaction [J].