Research on Reliability of Board Level Package-on-Package in Drop Test

Packaging components are key parts for portable electronics, such as notebooks, cameras and cell phones. The mechanical shock resulted from mishandling during transportation or customer usage may cause solder joint failure of packages, which leads to malfunction of product. Therefore, the reliability performance of solder balls under drop impact loading has become an important topics to researchers and the electronic product manufactures. Here, the study on the stacked package-on-package (POP) is completed in free drop test, according to the condition B in the drop test standard of JEDEC. The dynamic strain responses at some key positions of the Printed Circuit Board (PCB) are recorded by strain gages to study the board level response under impact, and the behavior of dynamic resistance of POP components is well understood. These researches will provide a feedback link to the performance of the PCB with POP packages in accidental drop.