Indentation creep of lead-free Sn-9Zn and Sn-8Zn-3Bi solder alloys

被引：74
作者：
Mahmudi, R. [1 ]
Geranmayeh, A. R. [2 ]
Khanbareh, H. [1 ]
Jahangiri, N. [1 ]
机构：
[1] Univ Tehran, Sch Met & Mat Engn, Tehran, Iran
[2] Islamic Azad Univ, Dept Mech Engn, S Tehran Branch, Tehran, Iran
来源：
MATERIALS & DESIGN | 2009年 / 30卷 / 03期
基金：
美国国家科学基金会;
关键词：
Creep; Mechanical; PB-FREE SOLDER; COOLING RATE; MECHANICAL-PROPERTIES; INTERFACIAL REACTIONS; IMPRESSION CREEP; SN-AG; BEHAVIOR; CU; DEFORMATION; TIN;
D O I：
10.1016/j.matdes.2008.05.058
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Creep behavior of Sn-9%Zn and Sn-8%Zn-3%Bi solders together with Sn-37% Pb, as the material for comparison, was studied by indentation tests at room-temperature (T> 0.6T(m)) in order to evaluate the correspondence of the creep results obtained by different methods of analysis, and to evaluate the effect of Bi on the creep response of the eutectic Sn-9%Zn alloy. Stress exponent values determined through these methods were in good agreement. The better creep resistance of the ternary alloy is attributed to solid solutioning effect and precipitation of Bi in the Sn matrix. Both tin-based alloys showed creep resistances higher than that of the Sn-37% Pb alloy. (C) 2008 Elsevier Ltd. All rights reserved,
引用
收藏
页码：574 / 580
页数：7
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