Influence of bonding condition on bonding process using Ag metallo-organic nanoparticles for high temperature lead-free packaging

We have proposed a novel bonding process using Ag metallo-organic nanoparticles with the average particle size of 11 nm, which can be the alternative to the Current die-attach process using lead-rich high temperature solders. The metallurgical bonding between Ag and Cu can be achieved in Cu-to-Cu joints using the Ag metallo-organic nanoparticles at temperatures lower than 573 K. Bonding parameters of the Cu-to-Cu joints bondability were examined based on the measurement of the shear strength of the joints and the observation of the fracture Surfaces and the cross-sectional microstructures. The joints using the Ag metallo-organic nanoparticles had the joint strength front 10 to 50 MPa depending on bonding, conditions. From the results, the bonding conditions providing the joint strength equivalent to those using, the lead-rich high melting point solders were proposed.