Dynamics of H atoms surface recombination in low-temperature plasma

被引:5
作者
Gubarev, V. [1 ,2 ]
Lopayev, D. [3 ]
Zotovich, A.
Blauw, M. A. [1 ,2 ]
Medvedev, V. [1 ,2 ]
Krainov, P. [2 ]
Astakhov, D. [2 ]
Zyryanov, S. [3 ,4 ]
机构
[1] Moscow Inst Phys & Technol, Dolgoprudnyi, Russia
[2] Russian Acad Sci, Inst Spect, Troitsk, Russia
[3] Moscow MV Lomonosov State Univ, Skobeltsyn Inst Nucl Phys, Moscow, Russia
[4] Lomonosov Moscow State Univ, Fac Phys, MSU, Moscow, Russia
基金
俄罗斯科学基金会;
关键词
Atoms - Extreme ultraviolet lithography - Plasma applications - Silica - Temperature;
D O I
10.1063/5.0119577
中图分类号
O59 [应用物理学];
学科分类号
摘要
The dynamics of H atom recombination on materials of interest for a EUV lithographer was studied under a long-term low-pressure H-2 plasma exposure. The similarity of the experimental plasma with the typical EUV-induced plasma over the multilayer mirrors surface of the EUV lithographic machine is demonstrated by means of 2D PIC MC simulation. The measurement of the temporal dynamics of the H atom surface loss probability (gamma(H)) is chosen for testing the surface modification during the treatment. Time-resolved actinometry of H atoms with Kr as the actinometer gas was used to detect the dynamics of the H-atom loss probability on the surface of Al, Ru, RVS, and SiO2. It is demonstrated that significant changes of the materials surface occur only at the very beginning of the treatment and are due to surface heating and cleaning effects. After that no changes in the gamma H are found, indicating that the surface stays absolutely stable. A special test of sensitivity of the used method to the state of surface was carried out. Dynamics of the gamma(H) changes with small O-2 addition clearly demonstrate modification of the Al surface due to oxidation with the next removal of oxygen by the H-2 plasma treatment. The rate of oxide removal is shown to be determined by plasma parameters such as the ion energy and flux to the surface. Published under an exclusive license by AIP Publishing.
引用
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页数:7
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