Kilopixel X-ray Microcalorimeter Arrays for Astrophysics: Device Performance and Uniformity

被引:13
作者
Eckart, M. E. [1 ,2 ,3 ]
Adams, J. S. [1 ,2 ,3 ]
Bailey, C. N. [1 ]
Bandler, S. R. [1 ,4 ,5 ]
Busch, S. E. [1 ]
Chervenak, J. A.
Finkbeiner, F. M. [1 ,6 ]
Kelley, R. L. [1 ]
Kilbourne, C. A. [1 ]
Porter, F. S. [1 ]
Porst, J. -P. [1 ,7 ]
Sadleir, J. E.
Smith, S. J. [1 ,2 ,3 ]
机构
[1] NASA, Goddard Space Flight Ctr, Xray Astrophys Lab, Greenbelt, MD 20771 USA
[2] Univ Maryland Baltimore Cty, Baltimore, MD 21250 USA
[3] CRESST, Camp Springs, MD 21250 USA
[4] Univ Maryland, College Pk, MD 20742 USA
[5] CRESST, College Pk, MD 20742 USA
[6] Wyle Informat Syst, Mclean, VA 22102 USA
[7] Brown Univ, Dept Phys, Providence, RI 02912 USA
关键词
Transition-edge sensors; Superconducting x-ray detectors; Astronomical x-ray instrumentation; Device characterization; LINES; SPECTROMETER;
D O I
10.1007/s10909-012-0514-x
中图分类号
O59 [应用物理学];
学科分类号
摘要
We are developing kilopixel arrays of TES microcalorimeters to enable high-resolution x-ray imaging spectrometers for future x-ray observatories and laboratory astrophysics experiments. Our current array design was targeted as a prototype for the X-ray Microcalorimeter Spectrometer proposed for the International X-ray Observatory, which calls for a 40x40-pixel core array of 300 mu m devices with 2.5 eV energy resolution (at 6 keV). Here we present device characterization of our 32x32 arrays, including x-ray spectral performance of individual pixels within the array. We present our results in light of the understanding that our Mo/Au TESs act as weak superconducting links, causing the TES critical current (I (c) ) and transition shape to oscillate with applied magnetic field (B). We show I (c) (B) measurements and discuss the uniformity of these measurements across the array, as well as implications regarding the uniformity of device noise and response. In addition, we are working to reduce pixel-to-pixel electrical and thermal crosstalk; we present recent test results from an array that has microstrip wiring and an angle-evaporated copper backside heatsinking layer, which provides copper coverage on the four sidewalls of the silicon wells beneath each pixel.
引用
收藏
页码:732 / 740
页数:9
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