Most methods for the treatment of scrap printed circuit boards do not reclaim the components in working Order as the boards are either fed to a copper smelter, to recover the valuable elements, or, simply landfilled. This work reports the dissolution of the solder in fluoroboric acid containing Ti4+ ions which was particularly selective for solder, allowing the components to be recovered. The solder was subsequently electrowon from the leachant. The boards were then shredded and the copper dissolved in ammonium sulfate and, then treated via solvent extraction to give an electrolyte suitable for electrowinning. The remainder of the metals were dissolved aqua regia, silver remained unattacked by the aqua regia, palladium precipitated as Pd(NH4)Cl-6 in the presence of zinc and nickel, the gold was removed by solvent extraction and precipitated as nanoparticles. The aqua regia was then diluted and the zinc and nickel separated by solvent extraction.
