RECOVERY OF COMPONENTS AND VALUABLE METALS FROM PRINTED CIRCUIT BOARDS

被引:0
作者
Gibson, A. [1 ]
Park, Y. P. [1 ]
Fray, D. J. [1 ]
机构
[1] Univ Cambridge, Dept Mat Sci & Met, Cambridge CB2 3QZ, England
来源
EPD CONGRESS 2009, PROCEEDINGS | 2009年
关键词
Printed Circuit Boards; Solder; Palladium; Gold; Zinc; Nickel; ELECTRONIC SCRAP; SEPARATION;
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Most methods for the treatment of scrap printed circuit boards do not reclaim the components in working Order as the boards are either fed to a copper smelter, to recover the valuable elements, or, simply landfilled. This work reports the dissolution of the solder in fluoroboric acid containing Ti4+ ions which was particularly selective for solder, allowing the components to be recovered. The solder was subsequently electrowon from the leachant. The boards were then shredded and the copper dissolved in ammonium sulfate and, then treated via solvent extraction to give an electrolyte suitable for electrowinning. The remainder of the metals were dissolved aqua regia, silver remained unattacked by the aqua regia, palladium precipitated as Pd(NH4)Cl-6 in the presence of zinc and nickel, the gold was removed by solvent extraction and precipitated as nanoparticles. The aqua regia was then diluted and the zinc and nickel separated by solvent extraction.
引用
收藏
页码:1101 / 1105
页数:5
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