Reliability of ICA attachment of SMDs on inkjet-printed substrates

被引：31

作者：

Niittynen, Juha ^{[1
]}

Kiilunen, Janne ^{[1
]}

Putaala, Jussi ^{[2
]}

Pekkanen, Ville ^{[1
]}

Mantysalo, Matti ^{[1
]}

Jantunen, Heli ^{[2
]}

Lupo, Donald ^{[1
]}

机构：

[1] Tampere Univ Technol, Dept Elect, FI-33101 Tampere, Finland

[2] Univ Oulu, Microelect & Mat Phys Labs, FI-90014 Oulu, Finland

来源：

MICROELECTRONICS RELIABILITY | 2012年 / 52卷 / 11期

关键词：

Flexible electronics - Substrates;

D O I：

10.1016/j.microrel.2012.05.001

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Printable electronics has been attracting considerable attention in recent years as a technology for flexible production of low-cost electrical devices on flexible substrates. Due to the additive nature of the production process, printable electronics offers to be a simple and effective method to manufacture electronics. Because the complexity and functionality of all-printed electrical devices is highly limited mainly by the low performance of semiconductive inks, external components are necessary for complex functionalities required in today's electrical devices. Such components must be attached to printed structures with connections having adequate electrical and mechanical performance and good long-term reliability. This study evaluated the reliability of isotropically conductive adhesive connections on inkjet-printed substrates and viewed ICA component connections as viable options for attaching SMD components on inkjet-printed circuits. (C) 2012 Elsevier Ltd. All rights reserved.

引用

页码：2709 / 2715

页数：7

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