Low temperature bonding technology for 3D integration

被引：127
作者：
Ko, Cheng-Ta [1 ]
Chen, Kuan-Neng [1 ]
机构：
[1] Natl Chiao Tung Univ, Dept Elect Engn, Hsinchu 300, Taiwan
来源：
MICROELECTRONICS RELIABILITY | 2012年 / 52卷 / 02期
关键词：
ROOM;
D O I：
10.1016/j.microrel.2011.03.038
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
3D integration provides a promising solution to achieve system level integration with high function density, small form factor, enhanced transmission speed and low power consumption. Stacked bonding is the key technology to enable the communication between different strata of the 3D integration system. Low temperature bonding approaches are explored in industry to solve the performance degradation issue of the integrated devices. In this paper, various low temperature bonding technologies are reviewed and introduced, as well as the latest developments in world-wide companies and research institutes. The outlook for industrial application is also addressed in the paper. (C) 2011 Elsevier Ltd. All rights reserved.
引用
收藏
页码：302 / 311
页数：10
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