Enhanced flip-chip packaging technique boosts IC reliability and performance

被引：0
|
作者：
Bursky, D
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来源：
ELECTRONIC DESIGN | 1999年 / 47卷 / 17期
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暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
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页码：29 / 30
页数：2
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