Microsensor packaging

被引：14

作者：

Brand, O ^{[1
]}

Baltes, H ^{[1
]}

机构：

[1] Swiss Fed Inst Technol, Phys Elect Lab, CH-8093 Zurich, Switzerland

来源：

MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS | 2002年 / 7卷 / 5-6期

关键词：

Silicon; Integrate Circuit; Thermal Imager; Cost Component; Ball Grid Array;

D O I：

10.1007/s005420100110

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Packaging is crucial for the success of microsensors and microsystems, and typically a major, if not dominating cost component. Benefiting from packaging methods for integrated circuits (IC), microsystem packaging currently strongly relies on customized solutions. The paper summarizes challenges in microsensor and microsystem packaging and briefly discusses current packaging trends. In the second part of the paper, a packaged low-cost CMOS thermal imager is presented. Its packaging is based on the direct attachment of a silicon infrared filter onto the CMOS sensor die. The final microsystem is further packaged in a plastic ball grid array (BGA) enabling subsequent assembly by standard surface mount technology.

引用

页码：205 / 208

页数：4

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