High-isolation lateral RF MEMS capacitive switch based on HfO2 dielectric for high frequency applications

被引:19
作者
He, X. J. [1 ,2 ]
Lv, Z. Q. [1 ]
Liu, B. [1 ]
Li, Z. H. [1 ,3 ]
机构
[1] Peking Univ, Natl Key Lab Sci & Technol Micro Nano Fabricat, Inst Microelect, Beijing 100871, Peoples R China
[2] Harbin Univ Sci & Technol, Dept Elect Sci & Technol, Sch Appl Sci, Harbin, Peoples R China
[3] Peking Univ, MEMS Res Ctr, Inst Microelect, Beijing 100871, Peoples R China
关键词
Lateral switch; Electrothermal-actuation; RF MEMS; Capacitive switch; ALD process; POLYSILICON;
D O I
10.1016/j.sna.2012.03.013
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, we have developed an electrothermally driven RF MEMS capacitive switch, where the HfO2 film, deposited by atomic layer deposition (ALD) process, was used as insulation dielectric between signal line and ground line. Thanks to high permittivity and excellent electrical and thermal isolation properties of the HfO2 film, as well as high driving force of the electrothermal actuator, the isolation of the proposed switch coated with the HfO2 film was up to 60 dB at 35 GHz and the bandwidth of isolation better than 25 dB was 10.5 GHz. The results demonstrate that the HfO2 film is a good candidate material serving as sidewall dielectric to realize the lateral capacitive switch with high RF performances. (C) 2012 Elsevier B.V. All rights reserved.
引用
收藏
页码:342 / 348
页数:7
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