共 50 条
- [32] Tension-driven three-dimensional printing of free-standing Field's metal structures NATURE ELECTRONICS, 2024, 7 (08): : 671 - 683
- [35] RELIABLE DESIGN OF TSV IN FREE-STANDING WAFERS AND 3D INTEGRATED PACKAGES PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2011, VOL 11, 2012, : 903 - 910
- [39] Three-Dimensional (3D) Integration Technology CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011), 2011, 34 (01): : 1011 - 1016