Topological insulator Bi2Te3 films synthesized by metal organic chemical vapor deposition

被引:66
作者
Cao, Helin [1 ,2 ]
Venkatasubramanian, Rama [3 ]
Liu, Chang [4 ,5 ]
Pierce, Jonathan [3 ]
Yang, Haoran [6 ]
Hasan, M. Zahid [4 ,5 ]
Wu, Yue [6 ]
Chen, Yong P. [1 ,2 ,7 ]
机构
[1] Purdue Univ, Dept Phys, W Lafayette, IN 47907 USA
[2] Purdue Univ, Birck Nanotechnol Ctr, W Lafayette, IN 47907 USA
[3] RTI Int, Ctr Solid State Energet, Res Triangle Pk, NC 27709 USA
[4] Princeton Univ, Dept Phys, Joseph Henry Labs, Princeton, NJ 08544 USA
[5] Princeton Univ, Princeton Inst Sci & Technol Mat, Princeton, NJ 08544 USA
[6] Purdue Univ, Sch Chem Engn, W Lafayette, IN 47907 USA
[7] Purdue Univ, Sch Elect & Comp Engn, W Lafayette, IN 47907 USA
关键词
BISMUTH TELLURIDE; THIN-FILMS; CRYSTAL-GROWTH; SUPERLATTICE STRUCTURES; THERMAL-PROPERTIES; SB2TE3; RESISTIVITY;
D O I
10.1063/1.4760226
中图分类号
O59 [应用物理学];
学科分类号
摘要
Topological insulator (TI) materials such as Bi2Te3 and Bi2Se3 have attracted strong recent interests. Large scale, high quality TI thin films are important for developing TI-based device applications. In this work, structural and electronic properties of Bi2Te3 thin films deposited by metal organic chemical vapor deposition (MOCVD) on GaAs (001) substrates were characterized via x-ray diffraction (XRD), Raman spectroscopy, angle-resolved photoemission spectroscopy (ARPES), and electronic transport measurements. The characteristic topological surface states with a single Dirac cone have been clearly revealed in the electronic band structure measured by ARPES, confirming the TI nature of the MOCVD Bi2Te3 films. Resistivity and Hall effect measurements have demonstrated relatively high bulk carrier mobility of similar to 350 cm(2)/Vs at 300 K and similar to 7400 cm(2)/Vs at 15 K. We have also measured the Seebeck coefficient of the films. Our demonstration of high quality topological insulator films grown by a simple and scalable method is of interests for both fundamental research and practical applications of thermoelectric and TI materials. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.4760226]
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页数:4
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