共 18 条
[1]
Abdelmaksoud W.A., 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, P1
[2]
Innovative Approaches of Experimentally Guided CFD Modeling for Data Centers
[J].
2015 31ST ANNUAL SEMICONDUCTOR THERMAL MEASUREMENT, MODELING & MANAGEMENT SYMPOSIUM (SEMI-THERM),
2015,
:176-184
[3]
Alissa H.A., 2015, INT ELECT PACKAGING
[4]
Arghode V. K., 2013, 2 INT WORKSH HEAT TR, P246
[5]
Arghode VK, 2015, P IEEE SEMICOND THER, P163, DOI 10.1109/SEMI-THERM.2015.7100155
[6]
Athavale J, 2016, INTERSOC C THERMAL T, P1162, DOI 10.1109/ITHERM.2016.7517680
[7]
Bash CE, 2006, 2006 PROCEEDINGS 10TH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONICS SYSTEMS, VOLS 1 AND 2, P445
[8]
Beitelmal M. H., 2009, INTERPACK200989035 A
[10]
Future Facilities, 2016, 6SIGMAROOM