Chemorheology of highly filled epoxy molding compounds

An understanding of the chemorheology (chemoviscosity and gel time data) of highly filled epoxy molding compounds (EMC) used in Integrated Circuit (IC) packaging has been restricted by their highly filled nature, fast kinetics of curing and viscoelastic properties. This paper examines the use of fundemental rheological techniques (such as the examination of wall slip and yield stress) combined with novel isothermal and nonisothermal multiwave parallel plate chemorheological tests to fully describe the chemorheology of the EMC system. This data may be then used to design and optimise IC packaging processes.