Interfacial reactions in the Sn-Sb/Ag and Sn-Sb/Cu couples

被引：31

作者：

Chen, Sinn-wen ^{[1
]}

Zi, An-ren ^{[1
]}

Chen, Po-yin ^{[1
]}

Wu, Hsin-jay ^{[1
]}

Chen, Yu-kai ^{[1
]}

Wang, Chao-hong ^{[1
]}

机构：

[1] Natl Tsing Hua Univ, Dept Chem Engn, Sect 2, Hsinchu 300, Taiwan

来源：

MATERIALS CHEMISTRY AND PHYSICS | 2008年 / 111卷 / 01期

关键词：

Sn-Sb; Ag; Cu; interfacial reactions;

D O I：

10.1016/j.matchemphys.2008.04.018

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Sn-Sb and Sn-Sb-based alloys are important high temperature solders. Interfacial reactions are examined in the Sn-5.0 at% Sb/Ag and Sn-10.0 at% Sb/Ag at 200 degrees C, and Sn-5.0 at% Sb/Cu and Sn-10.0 at% Sb/Cu at 250 degrees C. Only the Ag3Sn phase is formed in the Sn-Sb/Ag couples, and Cu6Sn5 and Cu3Sn phases are formed in the Sn-Sb/Cu couples. The reaction products all grow linearly with the square root of reaction time which suggests the interfacial reactions are diffusion controlled. (c) 2008 Elsevier B.V. All rights reserved.

引用

页码：17 / 19

页数：3

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