Design of high strength Cu alloy interlayer for mechanical bonding Ti to steel and characterization of their tri-layered clad

被引:24
作者
Ha, Jong Su [1 ]
Hong, Sun Ig [1 ]
机构
[1] Chungnam Natl Univ, Dept Adv Mat Engn, Taejon, South Korea
关键词
High pressure torsioning; Steel; Interface; Strength; Interlayer; TITANIUM/STAINLESS-STEEL; DIFFUSION; TITANIUM; MICROSTRUCTURE; STABILITY; DRAWN; STAINLESS;
D O I
10.1016/j.matdes.2013.04.068
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Cu-8 wt.% Ag alloy is proposed as a good interlayer alloy with good deformability, high strength, least reactivity and low melting temperature for low temperature joining of Ti and carbon steel. Titanium and carbon steel plates with a Cu-8Ag interlayer plate were joined by high pressure torsioning (HPT) at room temperature and the effect of post-HPT annealing on their mechanical performance was examined. The most pronounced increase of the Vickers microhardness (from 88 to 248 Hv) was observed in Cu-8Ag, suggesting Cu-Ag is the ideal bonding interlayer with a lower melting temperature, an initial excellent deformability and high strength after joining. With the increase of heat-treatment temperature, the tensile strength increased initially up to 350 degrees C and then decreased with increase of annealing temperature above 350 degrees C. The maximum strength after annealing at 250 degrees C is due to the combined effect of the precipitation strengthening of Cu-8Ag interlayer and static strain aging of both S20C and Ti. The stress-strain curves exhibited the step-wise fracture, with the first step resulting from the fracture of S20C plate and the next from co-fracture of Ti plate and Cu-Ag interlayer. The co-fracture of Cu-8Ag and Ti suggests that the bonding strength between two layers is fairly high even in the presence of intermetallic layer. (c) 2013 Elsevier Ltd. All rights reserved.
引用
收藏
页码:293 / 299
页数:7
相关论文
共 30 条
[1]  
ALEMAN B, 1993, MATER SCI TECH SER, V9, P633, DOI 10.1179/026708393790172376
[2]   Effect of Post Heat Treatment on Bonding Interfaces in Ti/Mild steel/Ti Clad Materials [J].
Bae, D. S. ;
Chae, Y. R. ;
Lee, S. P. ;
Lee, J. K. ;
Park, S. S. ;
Lee, Y. S. ;
Lee, S. M. .
11TH INTERNATIONAL CONFERENCE ON THE MECHANICAL BEHAVIOR OF MATERIALS (ICM11), 2011, 10 :996-1001
[3]   Microstructure and strength of wire-drawn Cu-Ag filamentary composites [J].
Benghalem, A ;
Morris, DG .
ACTA MATERIALIA, 1997, 45 (01) :397-406
[4]   Microstructure and strength of Cu-Fe in situ composites after very high drawing strains [J].
Biselli, C ;
Morris, DG .
ACTA MATERIALIA, 1996, 44 (02) :493-504
[5]   STATIC STRAIN-AGING IN COMMERCIAL PURITY ALPHA-TITANIUM [J].
DONOSO, JR ;
REEDHILL, RE .
METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1977, 8 (06) :945-948
[6]   Roll-Bonded Titanium/Stainless-Steel Couples, Part 1: Diffusion and Interface-Layer Investigations [J].
Dziallach, S. ;
Bleck, W. ;
Koehler, M. ;
Nicolini, G. ;
Richter, S. .
ADVANCED ENGINEERING MATERIALS, 2009, 11 (1-2) :75-81
[7]   Solid state diffusion bonding of titanium to steel using a copper base alloy as interlayer [J].
Elrefaey, A. ;
Tillmann, W. .
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2009, 209 (05) :2746-2752
[8]  
Gündüz S, 2005, PAMUKKALE U J ENG SC, V11, P147
[9]   Diffusion bonding technology of a titanium alloy to a stainless steel web with an Ni interlayer [J].
He, P ;
Zhang, JH ;
Zhou, RL ;
Li, XQ .
MATERIALS CHARACTERIZATION, 1999, 43 (05) :287-292
[10]   Yield strength of a heavily drawn Cu-20% Nb filamentary microcomposite [J].
Hong, SI .
SCRIPTA MATERIALIA, 1998, 39 (12) :1685-1691