Creep-fatigue life evaluation for Sn-3.5Ag solder

被引：15

作者：

Nozaki, M

Sakane, M

Tsukada, Y

Nishimura, H

机构：

[1] Hyogo Prefectural Inst Technol, Prod Innovat Dept, Suma Ku, Kobe, Hyogo 6540037, Japan

[2] Ritsumeikan Univ, Fac Sci & Engn, Dept Mech Engn, Kusatsu, Shiga 5258577, Japan

[3] KYOCERA SLC Technol Corp, Yasu, Shiga 5202362, Japan

[4] IBM Japan Ltd, Yasu, Shiga 5202392, Japan

来源：

JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME | 2006年 / 128卷 / 02期

关键词：

D O I：

10.1115/1.2172273

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

This paper studies the creep-fatigue life evaluation of Sn-3.5Ag solder under push-pull loading using fast-fast, fast-slow, slow-fast, slow-slow, and strain-hold strain waves. Extensive creep-fatigue data were generated using these strain waves and the applicability of four conventional creep-fatigue damage rules, the linear damage rule, the frequency modified fatigue life, the ductility exhaustion model, and the strain range partitioning method, was examined. No conventional damage rules evaluated creep-fatigue lives accurately. Only the grain boundary sliding model, developed recently for solders, predicted creep-fatigue lives with a small scatter.

引用

页码：142 / 150

页数：9