Creep-fatigue life evaluation for Sn-3.5Ag solder

被引：15
作者：
Nozaki, M
Sakane, M
Tsukada, Y
Nishimura, H
机构：
[1] Hyogo Prefectural Inst Technol, Prod Innovat Dept, Suma Ku, Kobe, Hyogo 6540037, Japan
[2] Ritsumeikan Univ, Fac Sci & Engn, Dept Mech Engn, Kusatsu, Shiga 5258577, Japan
[3] KYOCERA SLC Technol Corp, Yasu, Shiga 5202362, Japan
[4] IBM Japan Ltd, Yasu, Shiga 5202392, Japan
来源：
JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME | 2006年 / 128卷 / 02期
关键词：
D O I：
10.1115/1.2172273
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
This paper studies the creep-fatigue life evaluation of Sn-3.5Ag solder under push-pull loading using fast-fast, fast-slow, slow-fast, slow-slow, and strain-hold strain waves. Extensive creep-fatigue data were generated using these strain waves and the applicability of four conventional creep-fatigue damage rules, the linear damage rule, the frequency modified fatigue life, the ductility exhaustion model, and the strain range partitioning method, was examined. No conventional damage rules evaluated creep-fatigue lives accurately. Only the grain boundary sliding model, developed recently for solders, predicted creep-fatigue lives with a small scatter.
引用
收藏
页码：142 / 150
页数：9
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