An investigation on diffusion bonding of aluminum and magnesium using a Ni interlayer

被引:100
作者
Zhang, Jian [1 ]
Luo, Guoqiang [1 ]
Wang, Yiyu [1 ]
Shen, Qiang [1 ]
Zhang, Lianmeng [1 ]
机构
[1] Wuhan Univ Technol, State Key Lab Adv Technol Mat Synth & Proc, Wuhan 430070, Peoples R China
基金
中国国家自然科学基金;
关键词
Microstructure; Diffusion; Interface; Ni interlayer; Al-Mg; MG ALLOY; INTERMETALLIC COMPOUNDS; MECHANICAL-PROPERTIES; STAINLESS-STEEL; MICROSTRUCTURE; AL; INTERFACE; STRENGTH; COATINGS; JOINTS;
D O I
10.1016/j.matlet.2012.06.014
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Diffusion bonding aluminum and magnesium using a Ni interlayer was investigated for the first time. The bonding trials were carried out at 440 degrees C for different time under 1 MPa in a vacuum of 6 x 10(-3) Pa. The interfaces were investigated by means of SEM, EPMA, XRD and Vickers hardness test. The results showed that dissimilar metals of Mg/Al could be successfully joined by diffusion bonding with a Ni interlayer and the Mg-Al intermetallic compounds were impeded. From Al side to Mg side, there was Al substrate, Al-Ni reaction, layer. Ni interlayer, Mg-Ni reaction layer. Mg substrate. The microhardness in the Al-Ni reaction layer and Mg-Ni reaction layer increased sharply, which were 201.5 Hv and 244.1 Hv. The fracture occurred in the intermetallic compound layer of the Mg-Ni reaction layer, where the Mg2Ni phase appeared on both Al and Mg surfaces. (C) 2012 Elsevier B.V. All rights reserved.
引用
收藏
页码:189 / 191
页数:3
相关论文
共 22 条
[1]   STRUCTURE AND DIFFUSION PROCESSES IN LAMINATED COMPOSITES OF A Cu-Ti SYSTEM [J].
Bokstein, B. S. ;
Vnukov, V. I. ;
Golosov, E. V. ;
Karpov, M. I. ;
Kolobov, Yu. R. ;
Kolesnikov, D. A. ;
Korzhov, V. P. ;
Rodin, A. O. .
RUSSIAN PHYSICS JOURNAL, 2009, 52 (08) :811-815
[2]   Ni self-diffusion in alloyed Ni3Al [J].
Bokstein, BS ;
Bokstein, SZ ;
Spitsberg, IT .
INTERMETALLICS, 1996, 4 (07) :517-523
[3]  
Bokstein BS, 1993, DEF DIF FORUM, V445, P95
[4]   Formation of intermetallic compounds in Al and Mg alloy interface during friction stir spot welding [J].
Choi, Don-Hyun ;
Ahn, Byung-Wook ;
Lee, Chang-Yong ;
Yeon, Yun-Mo ;
Song, Keun ;
Jung, Seung-Boo .
INTERMETALLICS, 2011, 19 (02) :125-130
[5]   Transient liquid phase diffusion bonding Al-6061 using nano-dispersed Ni coatings [J].
Cooke, Kavian O. ;
Khan, Tahir I. ;
Oliver, Gossett D. .
MATERIALS & DESIGN, 2012, 33 :469-475
[6]   Diffusion coefficients of some solutes in fcc and liquid Al: critical evaluation and correlation [J].
Du, Y ;
Chang, YA ;
Huang, BY ;
Gong, WP ;
Jin, ZP ;
Xu, HH ;
Yuan, ZH ;
Liu, Y ;
He, YH ;
Xie, FY .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2003, 363 (1-2) :140-151
[7]   Liquid Phase Bonding of 316L Stainless Steel to AZ31 Magnesium Alloy [J].
Elthalabawy, Waled ;
Khan, Tahir .
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2011, 27 (01) :22-28
[8]   Microstructural development of diffusion-brazed austenitic stainless steel to magnesium alloy using a nickel interlayer [J].
Elthalabawy, Waled M. ;
Khan, Tahir I. .
MATERIALS CHARACTERIZATION, 2010, 61 (07) :703-712
[9]   An investigation on diffusion bonding of aluminum to copper using equal channel angular extrusion process [J].
Eslami, P. ;
Taheri, A. Karimi .
MATERIALS LETTERS, 2011, 65 (12) :1862-1864
[10]   Effect of bonding time on microstructure and mechanical properties of transient liquid phase bonded magnesium AZ31 alloy [J].
Jin, Y. J. ;
Khan, T. I. .
MATERIALS & DESIGN, 2012, 38 :32-37