共 50 条
- [1] Material Technology for 2.5D/3D Package IEEE CPMT SYMPOSIUM JAPAN 2015, (ICSJ 2015), 2015, : 101 - 104
- [2] Technology Trends in 2.5D/3D Packaging and Heterogeneous Integration 2021 5TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE (EDTM), 2021,
- [3] 2.5D and 3D Technology Challenges and Test Vehicle Demonstrations 2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 1068 - 1076
- [4] 2.5D/3D Packaging and Reliability: New Frontiers, Old Paradigms, and Opportunities (Invited) 2024 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, IRPS 2024, 2024,
- [5] Skeletonization of 3D Images using 2.5D and 3D Algorithms 2015 1ST INTERNATIONAL CONFERENCE ON NEXT GENERATION COMPUTING TECHNOLOGIES (NGCT), 2015, : 971 - 975
- [6] Design Methodology for Scalable 2.5D/3D Heterogenous Tiled Chiplet Systems PROCEEDINGS OF THE TWENTY THIRD INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN (ISQED 2022), 2022, : 377 - 380
- [7] Foundry Perspectives on 2.5D/3D Integration and Roadmap 2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2021,
- [9] Cost Comparison between 3D and 2.5D Integration 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2012,
- [10] 2.5D and 3D Heterogeneous Integration: Emerging applications IEEE Solid-State Circuits Magazine, 2021, 13 (04): : 77 - 87