Interfacial Bonding Behavior between Silver Nanoparticles and Gold Substrate Using Molecular Dynamics Simulation

被引：18

作者：

Ogura, Tomo ^{[1
]}

Nishimura, Masumi ^{[1
]}

Tatsumi, Hiroaki ^{[1
]}

Takahara, Wataru ^{[1
]}

Hirose, Akio ^{[1
]}

机构：

[1] Osaka Univ, Grad Sch Engn, Div Mat & Mfg Sci, Suita, Osaka 5650871, Japan

来源：

MATERIALS TRANSACTIONS | 2012年 / 53卷 / 12期

关键词：

silver nanoparticle; molecular dynamics simulation; interfacial bonding; neck growth; epitaxial layer; METALLOORGANIC NANOPARTICLES; COPPER NANOPARTICLES; TEMPERATURE;

D O I：

10.2320/matertrans.MB201201

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Molecular dynamics (MD) simulation was applied to the sintering behavior of silver nanoparticles on a gold substrate in order to elucidate the sintering mechanism of the nanoparticles on the substrate. The simulation revealed that silver atoms from 1 and 2 nm nanoparticles migrated freely because of their larger surface energy and then epitaxially reoriented to the gold substrate so as to reduce grain boundary energy. The silver nanoparticles were more spread out on the (011) gold substrate than on the (001) substrate, indicating that substrates with larger surface energy induce greater spreading rates. Consideration of the competition of neck growth and epitaxial growth in sintering of nanoparticles revealed that reduction of surface energy is the predominant driving force in the initiation of sintering of silver nanoparticles, and that the reduction of grain boundary energy is subsequently consequential.

引用

页码：2085 / 2090

页数：6

共 24 条

[1] Interfacial bonding mechanism using silver metallo-organic nanoparticles to bulk metals and observation of sintering behavior [J].