Challenges in On-Chip Antenna Design and Intergration With RF Receiver Front-End Circuitry in Nanoscale CMOS for 5G Communication Systems

被引:37
|
作者
Hedayati, Mahsa Keshavarz [1 ,2 ]
Abdipour, Abdolali [1 ]
Shirazi, Reza Sarraf [1 ]
Ammann, Max J. [3 ]
Johns, Matthias [3 ]
Cetintepe, Cagri [2 ]
Staszewski, Robert Bogdan [2 ]
机构
[1] Amirkabir Univ Technol, Dept Elect Engn, Tehran 1591634311, Iran
[2] Univ Coll Dublin, Sch Elect & Elect Engn, Dublin 4, Ireland
[3] Technol Univ Dublin, Antenna & High Frequency Res Ctr, City Campus, Dublin 8, Ireland
基金
美国国家科学基金会;
关键词
5G; mm-wave; nanometer-scale CMOS; 28 nm CMOS; active integrated antenna (AIA); antenna-on-chip (AoC); RF front-end; low noise amplifier (LNA); folded Gilbert cell mixer; on-chip transformer; PHASED-ARRAY TRANSCEIVER; MIXER;
D O I
10.1109/ACCESS.2019.2905861
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
This paper investigates design considerations and challenges of integrating on-chip antennas in nanoscale CMOS technology at millimeter-wave (mm-wave) to achieve a compact front-end receiver for 5G communication systems. Solutions to overcome these challenges are offered and realized in digital 28-nm CMOS. A monolithic on-chip antenna is designed and optimized in the presence of rigorous metal density rules and other back-end-of-the-line (BEoL) challenges of the nanoscale technology. The proposed antenna structure further exploits ground metallization on a PCB board acting as a reflector to increase its radiation efficiency and power gain by 37.3% and 9.8 dB, respectively, while decreasing the silicon area up to 30% compared to the previous works. The antenna is directly matched to a two-stage low noise amplifier (LNA) in a synergetic way as to give rise to an active integrated antenna (AIA) in order to avoid additional matching or interconnect losses. The LNA is followed by a double-balanced folded Gilbert cell mixer, which produces a lower intermediate frequency (IF) such that no probing is required for measurements. The measured total gain of the AIA is 14 dBi. Its total core area is 0.83 mm(2) while the total chip area, including the pad frame, is 1.55 x 0.85 mm(2).
引用
收藏
页码:43190 / 43204
页数:15
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