Thermodynamics and thermal stress analysis of thermoelectric power generator: Influence of pin geometry on device performance

被引:153
作者
Al-Merbati, A. S. [1 ]
Yilbas, B. S. [1 ]
Sahin, A. Z. [1 ]
机构
[1] KFUPM, Dept Mech Engn, Dhahran 31261, Saudi Arabia
关键词
Thermoelectric; Power generation; Thermal stress; Efficiency; MECHANICAL-PROPERTIES;
D O I
10.1016/j.applthermaleng.2012.07.021
中图分类号
O414.1 [热力学];
学科分类号
摘要
Thermodynamics and thermal stress analysis of thermo-electric power generator is carried out. The influence of device geometry on thermal stress, thermal efficiency and output power is examined. The finite element method is incorporated to predict temperature and stress fields in the thermo electric device. It is found that thermal efficiency improves for certain geometric configuration of the device. In this case; the maximum thermal stress developed in the pin reduces slightly indicating improved life expectation of the device. (C) 2012 Elsevier Ltd. All rights reserved.
引用
收藏
页码:683 / 692
页数:10
相关论文
共 17 条
  • [1] *ABAQUS INC, 2009, ABAQUS THEOR MAN VER
  • [2] Thermal Stress Analysis and Structure Parameter Selection for a Bi2Te3-Based Thermoelectric Module
    Gao, Jun-Ling
    Du, Qun-Gui
    Zhang, Xiao-Dan
    Jiang, Xin-Qiang
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2011, 40 (05) : 884 - 888
  • [3] Thermoelectric cooling of microelectronic circuits and waste heat electrical power generation in a desktop personal computer
    Gould, C. A.
    Shammas, N. Y. A.
    Grainger, S.
    Taylor, I.
    [J]. MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS, 2011, 176 (04): : 316 - 325
  • [4] Efficiency Study of a Commercial Thermoelectric Power Generator (TEG) Under Thermal Cycling
    Hatzikraniotis, E.
    Zorbas, K. T.
    Samaras, I.
    Kyratsi, Th.
    Paraskevopoulos, K. M.
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2010, 39 (09) : 2112 - 2116
  • [5] Hikage Y., 2007, INT C THERM ICT 07 P, P331
  • [6] Numerical Modeling and Design of Thermoelectric Cooling Systems
    Jou, Rong-Yuan
    [J]. MECHANICAL AND AEROSPACE ENGINEERING, PTS 1-7, 2012, 110-116 : 2639 - 2646
  • [7] Nakatani Y, 2005, MATER RES SOC SYMP P, V842, P413
  • [8] Three-dimensional solution for transient thermal stresses of functionally graded rectangular plate due to nonuniform heat supply
    Ootao, Y
    Tanigawa, Y
    [J]. INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2005, 47 (11) : 1769 - 1788
  • [9] Thermal Expansion Studies of Selected High-Temperature Thermoelectric Materials
    Ravi, Vilupanur
    Firdosy, Samad
    Caillat, Thierry
    Brandon, Erik
    Van der Walde, Keith
    Maricic, Lina
    Sayir, Ali
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2009, 38 (07) : 1433 - 1442
  • [10] Investigation into topping cycle: Thermal efficiency with and without presence of thermoelectric generator
    Sahin, A. Z.
    Yilbas, B. S.
    Shuja, S. Z.
    Momin, O.
    [J]. ENERGY, 2011, 36 (07) : 4048 - 4054