Technological drivers in data centers and telecom systems: Multiscale thermal, electrical, and energy management

被引:105
作者
Garimella, Suresh V. [1 ]
Persoons, Tim [2 ]
Weibel, Justin [1 ]
Yeh, Lian-Tuu [3 ]
机构
[1] Purdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
[2] Univ Dublin Trinity Coll, Dept Mech & Mfg Engn, Dublin 2, Ireland
[3] Huawei Technol, North Amer Headquarters, Santa Clara, CA 95050 USA
关键词
Electronics cooling; 3D chip packaging; Power utilization effectiveness; Total cost of ownership; Cloud computing; Alternative air movers; DESIGN; FLOW; PERFORMANCE; PREDICTION; WICKS;
D O I
10.1016/j.apenergy.2013.02.047
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
We identify technological drivers for tomorrow's data centers and telecommunications systems, including thermal, electrical and energy management challenges, based on discussions at the 2nd Workshop on Thermal Management in Telecommunication Systems and Data Centers in Santa Clara, California, on April 25-26, 2012. The relevance of thermal management in electronic systems is reviewed against the background of the energy usage of the information technology (IT) industry, encompassing perspectives of different sectors of the industry. The underlying drivers for progress at the business and technology levels are identified. The technological challenges are reviewed in two main categories - immediate needs and future needs. Enabling cooling techniques that are currently under development are also discussed. (C) 2013 Elsevier Ltd. All rights reserved.
引用
收藏
页码:66 / 80
页数:15
相关论文
共 87 条
[1]   Analysis and Prediction of the Thermal Performance of Piezoelectrically Actuated Fans [J].
Acikalin, Tolga ;
Garimella, Suresh V. .
HEAT TRANSFER ENGINEERING, 2009, 30 (06) :487-498
[2]  
Alfieri F, 2010, P 14 INT HEAT TRANSF
[3]   On the significance of developing boundary layers in integrated water cooled 3D chip stacks [J].
Alfieri, Fabio ;
Tiwari, Manish K. ;
Zinovik, Igor ;
Brunschwiler, Thomas ;
Michel, Bruno ;
Poulikakos, Dimos .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2012, 55 (19-20) :5222-5232
[4]  
Altman DH, 2012, ELECT COOL MAR, P20
[5]   Dynamics of Droplet Motion under Electrowetting Actuation [J].
Annapragada, S. Ravi ;
Dash, Susmita ;
Garimella, Suresh V. ;
Murthy, Jayathi Y. .
LANGMUIR, 2011, 27 (13) :8198-8204
[6]  
[Anonymous], ELECT COOLING
[7]  
[Anonymous], 1988, 92961988 ISO
[8]  
[Anonymous], 2008, REVOLUTIONIZING DATA
[9]  
[Anonymous], 2010, 112012010 ISO
[10]  
[Anonymous], 1996, 103021996 ISO