Simulation of Squeeze-Film Damping of Microplates Actuated by Large Electrostatic Load

被引:42
作者
Younis, Mohammad I. [1 ]
Nayfeh, Ali H. [2 ]
机构
[1] SUNY Binghamton, Dept Mech Engn, Binghamton, NY 13902 USA
[2] Virginia Polytech Inst & State Univ, Dept Engn Sci & Mech, Blacksburg, VA 24061 USA
来源
JOURNAL OF COMPUTATIONAL AND NONLINEAR DYNAMICS | 2007年 / 2卷 / 03期
关键词
squeeze-film dumping; von Karman plate equations; large deflections; electrostatic actuation;
D O I
10.1115/1.2727491
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
We present a new method for simulating squeeze-film damping of microplates actuated by large electrostatic loads. The method enables the prediction of the quality factors of microplates under a limited range of gas pressures and applied electrostatic loads up to the pull-in instability. The method utilizes the nonlinear Euler-Bernoulli beam equation, the von Karman plate equations, and the compressible Reynolds equation. The static deflection of the microplate is calculated using the beam model. Analytical expressions are derived for the pressure distribution in terms of the plate mode shapes around the deflected position using perturbation techniques. The static deflection and the analytical expressions are substituted into the plate equations, which are solved using a finite element method. Several results are presented showing the effect of the pressure and the electrostatic force on the structural mode shapes, the pressure distributions, the natural frequencies, and the quality factors.
引用
收藏
页码:232 / 241
页数:10
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