Role of low-temperature AlGaN interlayers in thick GaN on silicon by metalorganic vapor phase epitaxy

被引:36
作者
Fritze, S. [1 ]
Drechsel, P. [2 ]
Stauss, P. [2 ]
Rode, P. [2 ]
Markurt, T. [3 ]
Schulz, T. [3 ]
Albrecht, M. [3 ]
Blaesing, J. [1 ]
Dadgar, A. [1 ]
Krost, A. [1 ]
机构
[1] Univ Magdeburg, Inst Expt Phys, D-39106 Magdeburg, Germany
[2] Osram Opto Semicond, D-93055 Regensburg, Germany
[3] Leibniz Inst Kristallzuchtung, D-12489 Berlin, Germany
关键词
X-RAY-DIFFRACTION; ALN INTERLAYERS; SI(111) SUBSTRATE; DEFECT STRUCTURE; STRESS; GROWTH; REDUCTION; FILMS; SI; STRAIN;
D O I
10.1063/1.4729044
中图分类号
O59 [应用物理学];
学科分类号
摘要
Thin AlGaN interlayers have been grown into a thick GaN stack on Si substrates to compensate tensile thermal stress and significantly improve the structural perfection of the GaN. In particular, thicker interlayers reduce the density in a-type dislocations as concluded from x-ray diffraction (XRD) measurements. Beyond an interlayer thickness of 28 nm plastic substrate deformation occurs. For a thick GaN stack, the first two interlayers serve as strain engineering layers to obtain a crack-free GaN structure, while a third strongly reduces the XRD x-(0002)-FWHM. The vertical strain and quality profile determined by several XRD methods demonstrates the individual impact of each interlayer. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.4729044]
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页数:6
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