Rectification of evanescent heat transfer between dielectric-coated and uncoated silicon carbide plates

被引:81
作者
Iizuka, Hideo [1 ]
Fan, Shanhui [2 ]
机构
[1] Toyota Cent Res & Dev Labs Inc, Nagakute, Aichi 4801192, Japan
[2] Stanford Univ, Dept Elect Engn, Stanford, CA 94305 USA
关键词
Plates (structural components) - Permittivity - Heat transfer - Coatings;
D O I
10.1063/1.4737465
中图分类号
O59 [应用物理学];
学科分类号
摘要
Here, we show analytically that the thermal rectification via evanescent waves is obtained in the parallel semi-infinite bodies of the dielectric-coated silicon carbide and uncoated silicon carbide. The permittivity and the thickness of the dielectric coating are derived for maximizing the thermal rectification. In the nonequilibrium situation holding temperatures of 500 K for one body and 300 K for the other, either a coating with a high permittivity of 14 and a thickness of 1 nm or a coating with a low permittivity of 2 and a thickness exceeding 10 nm, results in rectifying coefficients of 0.4 to 0.44. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.4737465]
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页数:7
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