Implementation of a Fast and Low-Power Thermopile Readout Circuit Arrangement for Array Processors

被引:3
|
作者
Gronroos, Mika [1 ]
Nevalainen, Tapani [1 ]
Paasio, Ari [1 ]
机构
[1] Univ Turku, Dept Future Technol, Turku 20014, Finland
基金
芬兰科学院;
关键词
Fast infrared imaging; thermal imaging; array processors; digital integration; prediction algorithm; thermopile sensors; FOCAL-PLANE ARRAY; LOW-TEMPERATURE; VISION; LWIR;
D O I
10.1109/TCSII.2018.2821898
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
High-speed thermal imaging is necessary in many applications. However, the traditional column-wise readout implementations reduce the achievable frame rate. Also, analog integration for each individual pixel is not possible without sacrificing pixel area. In this brief, we present an implementation of a fast and low-power pixel-wise readout circuit scheme with a digital integration method using 65-nm standard CMOS technology. The power consumption of the readout circuit is up to 15 mu W and the layout area is 100 mu m x 100 mu m. Furthermore, we analyze our design for non-idealities, such as noise and process mismatches using a circuit simulator.
引用
收藏
页码:537 / 541
页数:5
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