Low power GaAs current-mode 1.2 Gb/s interchip interconnections

被引:17
作者
Long, SI [1 ]
Zhang, JQ [1 ]
机构
[1] HEWLETT PACKARD CORP,FT COLLINS,CO 80525
关键词
current-mode interconnections; feedback circuits; integrated circuit desing; integrated circuit interconnections; logic design; multichip modules; very-high-speed integrated circuits;
D O I
10.1109/4.585291
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A new GaAs current-mode (CM) chip-to-chip interconnection circuit is presented that provides high signal transfer speed with a 50 Omega active termination and reduced input voltage swing, The power dissipation is shown to be 1/8 of an ECL I/O at the same data rate, 4 mW per pin, using a standard 2 V power supply, The driver-receiver operates with a current swing under 1 mA and provides a large noise margin.
引用
收藏
页码:890 / 897
页数:8
相关论文
共 9 条
[1]  
Bakoglu H., 1990, CIRCUITS INTERCONNEC
[2]   STATIC AND DYNAMIC NOISE MARGINS OF LOGIC-CIRCUITS [J].
LOHSTROH, J .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1979, 14 (03) :591-598
[3]  
LONG S, 1990, GALLIUM ARSENIDE DIG, P210
[4]  
LONG SI, 1994, 12 NORCHIP SEM GOTH, P93
[5]  
*MICR MICR STAND S, 1993, P1596394D10
[6]   HIGH-SPEED INTEGRATED INJECTION LOGIC (I2L) [J].
MULDER, C ;
WULMS, HEJ .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1976, 11 (03) :379-385
[7]   CURRENT-MODE TECHNIQUES FOR HIGH-SPEED VLSI CIRCUITS WITH APPLICATION TO CURRENT SENSE AMPLIFIER FOR CMOS SRAMS [J].
SEEVINCK, E ;
VANBEERS, PJ ;
ONTROP, H .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1991, 26 (04) :525-536
[8]  
*VIT SEM CORP, HGAAS3 MOD VERS 3 11
[9]  
ZHANG JQ, 1995, 17 IEEE GAAS IC S SA, P327