Induction Soldering of Coated Conductor High-Temperature Superconducting Tapes With Lead-Free Solder Alloys

被引:13
作者
Drienovsky, Marian [1 ]
Michalcova, Eva [1 ]
Pekarcikova, Marcela [1 ]
Palcut, Marian [1 ]
Frolek, Lubomir [2 ]
Gogola, Peter [1 ]
Jancuska, Igor [1 ]
Misik, Jozef [1 ]
Gomory, Fedor [2 ]
机构
[1] Slovak Univ Technol Bratislava, Fac Mat Sci & Technol Trnava, Trnava 91724, Slovakia
[2] Slovak Acad Sci, Inst Elect Engn, Bratislava 84104, Slovakia
关键词
Contact resistance; induction heating; 2G HTS conductors; microstructure; soldering; AG-CU SOLDER; MICROSTRUCTURE; SUBSTRATE; JOINTS; FE;
D O I
10.1109/TASC.2018.2805102
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, the joints of rare earth barium copper oxide high-temperature superconducting (HTS) tapes with surrounding copper stabilizer were prepared by induction heating. The HTS tapes with the overlap of 35 mm were joined by using two types of Sn-Ag-Cu solder alloys: near eutectic and hypoeutectic. The quality of the joints has been studied by measuring the current-voltage curve, from which the joint electrical resistance, critical current, and n-value were determined. The electrical characterization has been followed by microstructural investigation of the solder tape interface by using scanning electron microscopy. The chemical composition of the solder alloys influenced the joint quality. Furthermore, there is a notable difference in microstructure between induction soldered joints and reflow soldered joints by electrical resistivity furnace.
引用
收藏
页数:5
相关论文
共 28 条
[11]  
Kim I, 2015, Supercond. Sci. Technol., V29, DOI DOI 10.1088/0953-2048/29/1/015005
[12]   Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints [J].
Kunwar, Anil ;
Shang, Shengyan ;
Raback, Peter ;
Wang, Yunpeng ;
Givernaud, Julien ;
Chen, Jun ;
Ma, Haitao ;
Song, Xueguan ;
Zhao, Ning .
MICROELECTRONICS RELIABILITY, 2018, 80 :55-67
[13]   Eddy current induced heating for the solder reflow of area array packages [J].
Li, Mingyu ;
Xu, Hongbo ;
Lee, Shi-Wei Ricky ;
Kim, Jongmyung ;
Kim, Daewon .
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2008, 31 (02) :399-403
[14]   Lap Joint Resistance of YBCO Coated Conductors [J].
Lu, Jun ;
Han, Ke ;
Sheppard, William R. ;
Viouchkov, Youri L. ;
Pickard, Kenneth W. ;
Markiewicz, William Denis .
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2011, 21 (03) :3009-3012
[15]   HTS Tapes Selection for Superconducting Current Limiters [J].
Majka, Michal ;
Kozak, Janusz ;
Kozak, Slawomir .
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2017, 27 (04)
[16]   Joining of CC Tapes With Lead-Free Solders [J].
Michalcova, E. ;
Gomory, F. ;
Frolek, L. ;
Drienovsky, M. ;
Pekarcikova, M. ;
Skarba, M. ;
Misik, J. ;
Janovec, J. .
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2016, 26 (03)
[17]   Heating and Loading Process Improvement for Indium Inserted Mechanical Lap Joint of REBCO Tapes [J].
Nishio, Tatsuki ;
Ito, Satoshi ;
Hashizume, Hidetoshi .
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2017, 27 (04)
[18]   Numerical Study on Silver Diffusion Joints of Coated Conductors by Finite-Element Method [J].
Sheng, J. ;
Zeng, W. ;
Wu, W. ;
Ma, J. ;
Li, Z. ;
Jin, Z. ;
Hong, Z. .
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2016, 26 (04)
[19]   Joining of REBCO Coated Conductor Tapes Using Ultrasonic Welding Method [J].
Shin, Hyung-Seop ;
Nisay, Arman ;
de Leon, Michael B. ;
Dedicatoria, Marlon J. .
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2015, 25 (03)
[20]   Comparison of the Bending Strain Effect on Transport Property in Lap- and Butt-Jointed Coated Conductor Tapes [J].
Shin, Hyung-Seop ;
Dedicatoria, Marlon J. .
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2010, 20 (03) :1541-1544