A high-entropy alloy as very low melting point solder for advanced electronic packaging

被引：51
作者：
Liu, Y. [1 ]
Pu, L. [1 ]
Yang, Y. [2 ,3 ]
He, Q. [2 ]
Zhou, Z. [2 ]
Tan, C. [1 ]
Zhao, X. [1 ]
Zhang, Q. [1 ]
Tu, K. N. [4 ]
机构：
[1] Beijing Inst Technol, Dept Mat Sci & Engn, Beijing, Peoples R China
[2] City Univ Hong Kong, Dept Mech Engn, Hong Kong, Peoples R China
[3] City Univ Hong Kong, Dept Mat Sci & Engn, Hong Kong, Peoples R China
[4] Univ Calif Los Angeles, Dept Mat Sci & Engn, Los Angeles, CA 90024 USA
来源：
MATERIALS TODAY ADVANCES | 2020年 / 7卷
基金：
中国国家自然科学基金;
关键词：
Pb-free solder; Diffusion kinetics; Liquid-solid reactions; High-entropy alloy; Advanced electronic packaging technology; INTERFACIAL REACTIONS; COMPOUND FORMATION; SN; MICROSTRUCTURES; GROWTH; NI;
D O I：
10.1016/j.mtadv.2020.100101
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
SnBiInZn-based high-entropy alloy (HEA) was studied as a low reflow temperature solder with melting point around 80 degrees C. The wetting angle is about 52 degrees after reflow at 100 degrees C for 10 min. The intermetallic compound (IMC) growth kinetics was measured to be ripening-control with a low activation energy about 18.0 kJ/mol; however, the interfacial reaction rate is very slow, leading to the formation of a very thin IMC layer. The low melting point HEA solder has potential applications in advanced electronic packaging technology, especially for biomedical devices. (c) 2020 The Author(s). Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
引用
收藏
页数：8
相关论文
共 26 条
[1]   A novel ultrafine-grained high entropy alloy with excellent combination of mechanical and soft magnetic properties [J].
Chen, Chen ;
Zhang, Hang ;
Fan, Yanzhou ;
Zhang, Weiwei ;
Wei, Ran ;
Wang, Tan ;
Zhang, Tao ;
Li, Fushan .
JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, 2020, 502
[2]   Fundamental electronic structure and multiatomic bonding in 13 biocompatible high-entropy alloys [J].
Ching, Wai-Yim ;
San, Saro ;
Brechtl, Jamieson ;
Sakidja, Ridwan ;
Zhang, Miqin ;
Liaw, Peter K. .
NPJ COMPUTATIONAL MATERIALS, 2020, 6 (01)
[3]   The effect of molybdenum on the corrosion behaviour of the high-entropy alloys Co1.5CrFeNi1.5Ti0.5Mox in aqueous environments [J].
Chou, Y. L. ;
Yeh, J. W. ;
Shih, H. C. .
CORROSION SCIENCE, 2010, 52 (08) :2571-2581
[4]   Design of High-Entropy Alloy: A Perspective from Nonideal Mixing [J].
He, Q. F. ;
Ding, Z. Y. ;
Ye, Y. F. ;
Yang, Y. .
JOM, 2017, 69 (11) :2092-2098
[5]   Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper [J].
Hsiao, Hsiang-Yao ;
Liu, Chien-Min ;
Lin, Han-Wen ;
Liu, Tao-Chi ;
Lu, Chia-Ling ;
Huang, Yi-Sa ;
Chen, Chih ;
Tu, K. N. .
SCIENCE, 2012, 336 (6084) :1007-1010
[6]   Microstructures developed in solid-liquid reactions: using Cu-Sn reaction, Ni-Bi reaction, and Cu-In reaction as examples [J].
Kao, CR .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1997, 238 (01) :196-201
[7]   Mechanical properties of Pb-free SnAg solder joints [J].
Keller, J. ;
Baither, D. ;
Wilke, U. ;
Schmitz, G. .
ACTA MATERIALIA, 2011, 59 (07) :2731-2741
[8]   Survey of High-Temperature Reliability of Power Electronics Packaging Components [J].
Khazaka, R. ;
Mendizabal, L. ;
Henry, D. ;
Hanna, R. .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2015, 30 (05) :2456-2464
[9]   Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening [J].
Kim, HK ;
Tu, KN .
PHYSICAL REVIEW B, 1996, 53 (23) :16027-16034
[10]   Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering [J].
Kroupa, Ales ;
Andersson, Dag ;
Hoo, Nick ;
Pearce, Jeremy ;
Watson, Andrew ;
Dinsdale, Alan ;
Mucklejohn, Stuart .
JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2012, 21 (05) :629-637
123