Interfacial fracture energy measurements in the Cu/Cr/polyimide system

被引:37
作者
Park, YB [1 ]
Park, IS
Yu, J
机构
[1] Korea Adv Inst Sci & Technol, Dept Mat Sci & Engn, Taejon 305701, South Korea
[2] LG Semicon Co Ltd, Package R&D Ctr, Cheongju 360480, South Korea
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 1999年 / 266卷 / 1-2期
关键词
Cu film; interfacial fracture energy; peel test; polyimide; X-ray analysis;
D O I
10.1016/S0921-5093(98)01117-4
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The interfacial fracture energies, Gamma, of the Cu/Cr/polyimide system were deduced under varying Cu film thickness and pretreatment conditions based on two methods: X-ray measurement by Park and Yu and theoretical methods by Moidu et al. The two methods showed reasonable agreement for most cases, imparting validity for both approaches. Estimated Gamma values were quite independent of the metal film thickness and increased with the rf plasma power density of polyimide pretreatment as expected. Estimated values of Gamma were 46.8 +/- 17.8, 170.3 +/- 42.9 and 253.9 +/- 44.4 J m(-2) for the rf plasma power density of 0.03, 0.036 and 0.05 W cm(-2), respectively. (C) 1999 Elsevier Science S.A. All rights reserved.
引用
收藏
页码:261 / 266
页数:6
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