Compensation and doping effects in heavily helium-radiated silicon for power device applications

被引:19
作者
Siemieniec, R
Schulze, HJ
Niedernostheide, F
Südkamp, W
Lutz, J
机构
[1] Infineon Technol Austria AG, Automot & Ind, Villach 9500, Australia
[2] Infineon Technol AG, Automot & Ind, D-81726 Munich, Germany
[3] Aktiv Sensor GmbH, D-14532 Stahnsdorf, Germany
[4] Tech Univ Chemnitz, Fac Elect Engn & Informat Technol, D-09107 Chemnitz, Germany
关键词
lifetime control; recombination centres; compensation effects; doping effects; helium irradiation;
D O I
10.1016/j.mejo.2005.09.011
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The formation of defects modifying the effective doping concentration of helium-radiated p(+)-n(-)-n(+) and p(+)-p(-)-n(+) silicon diodes is analyzed as a function of' the annealing temperature. After irradiation with helium at high energy levels and annealing at 220 degrees C, the probable formation of divacancy clusters increases the number of charged-acceptor states in a space-charge region. Capacitance-Voltage and Spreading-Resistance Profile measurements show that annealing at 350 degrees C results in the formation of an acceptor-like defect that deep level transient spectroscopy measurements suggest can be tentatively attributed to the V2O or V-4/V-5 Centre. Annealing at 430 degrees C results in the disappearance of acceptor-like defect. Instead, pronounced donor formation in a range close to the penetration depth of the helium ions is observed. The influence of these effects on device characteristics is discussed. (c) 2005 Elsevier Ltd. All rights reserved.
引用
收藏
页码:204 / 212
页数:9
相关论文
共 21 条
[1]  
AMMERLAAN CAJ, 1999, PROPERTIES CRYSTALLI, V20, P663
[2]   DEFECT PRODUCTION AND LIFETIME CONTROL IN ELECTRON AND GAMMA-IRRADIATED SILICON [J].
BROTHERTON, SD ;
BRADLEY, P .
JOURNAL OF APPLIED PHYSICS, 1982, 53 (08) :5720-5732
[3]   INFLUENCE OF RECOMBINATION CENTER DATA ON IV CHARACTERISTICS OF SILICON P+-I-N+ DIODES [J].
DUDECK, I ;
KASSING, R .
JOURNAL OF APPLIED PHYSICS, 1977, 48 (11) :4786-4790
[4]  
GAJEWSKI H, 1991, TESCA HDB
[5]   Bulk damage effects in irradiated silicon detectors due to clustered divacancies [J].
Gill, K ;
Hall, G ;
MacEvoy, B .
JOURNAL OF APPLIED PHYSICS, 1997, 82 (01) :126-136
[6]   ELECTRON TRAP ANNEALING IN NEUTRON TRANSMUTATION DOPED SILICON [J].
GULDBERG, J .
APPLIED PHYSICS LETTERS, 1977, 31 (09) :578-579
[7]   Divacancy profiles in MeV helium irradiated silicon from reverse I-V measurement [J].
Hazdra, P ;
Rubes, J ;
Vobecky, J .
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 1999, 159 (04) :207-217
[8]  
KAMINSKI N, 1999, P EPE LAUS
[9]  
LUTZ J, 1997, P EPE 97, P1502
[10]   Formation of a double acceptor center during divacancy annealing in low-doped high-purity oxygenated Si -: art. no. 233207 [J].
Monakhov, EV ;
Avset, BS ;
Hallén, A ;
Svensson, BG .
PHYSICAL REVIEW B, 2002, 65 (23) :2332071-2332074