ANALYTICAL SOLUTIONS OF BIO-HEAT CONDUCTION ON SKIN IN FOURIER AND NON-FOURIER MODELS

被引:23
|
作者
Lin, Shueei-Muh [1 ]
机构
[1] Kun Shan Univ, Dept Mech Engn, Tainan 71003, Taiwan
关键词
Fourier model; C-V model; Dual-phase-lag model; skin tissue; conduction; analytical solution; thermal injury; LEQUATION;
D O I
10.1142/S0219519413500632
中图分类号
Q6 [生物物理学];
学科分类号
071011 ;
摘要
In general, the transport of thermal energy in living tissue is a complex process. The analysis of the heat conduction of skin tissue is helpful for understanding of the bio-thermo-mechanical behavior of skin tissue. So far, three kinds of conduction law - (1) the Fourier model, (2) the C-V model and (3) dual-phase-lag (DPL) model - are often investigated in bio-thermal transfer process. In this study, the mathematical model of heat conduction of the skin tissue subjected to a general transient heating at the skin surface was established. The analytical solutions of these three conduction models are presented. In addition, the measure of thermal injury of the skin tissue subjected to a harmonic heating was investigated. It was found that the phenomenon of Fourier model is greatly different to those of the C-V and DPL models. Moreover, the effects of the phase lags, the heating frequency, and the heat quantity on the temperature variation and the index of thermal injury were significant. In sum, the analytical method can be used to solve the conduction problem of any one-layer tissue.
引用
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页数:17
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